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| Freescale Semiconductor Technical Data MPXV7025G Rev 0, 05/2005 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV7025G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features * 5.0% Maximum Error Over 0 to 85C * Ideally Suited for Microprocessor or Microcontroller-Based Systems * Temperature Compensated Over -40 to +125C * Thermoplastic (PPS) Surface Mount Package * Patented Silicon Shear Stress Strain Gauge * Available in Differential and Gauge Configurations Typical Applications * Respiratory Systems * Process Control * Patient Monitoring * Remote Monitoring Devices ORDERING INFORMATION Device Type Options Case No. MPX Series Order No. Packing Options Device Marking MPXV7025G SERIES INTEGRATED PRESSURE SENSOR -25 to 25 kPa (-3.6 to 3.6 psi) 0.2 to 4.7 V OUTPUT SMALL OUTLINE PACKAGE MPXV7025GC6U CASE 482A-01 MPXV7025GP CASE 1369-01 MPXV7025DP CASE 1351-01 SMALL OUTLINE PACKAGE PIN NUMBERS(1) 1 2 3 Rails MPXV7025G 4 N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C SMALL OUTLINE PACKAGE (MPXV7025G SERIES) Ported Gauge, Axial Port, SMT Elements Gauge, Axial Port, SMT Gauge, Side Port, SMT Gauge, Dual Port, SMT 482A 482A 1369 1351 MPXV7025GC6U MPXV7025GC6T1 Tape & MPXV7025G Reel MPXV7025GP MPXV7025DP Trays MPXV7025G Trays MPXV7025G VS 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Sensing Element Thin Film Temperature Compensation and Gain Stage #1 Gain Stage #2 and Ground Reference Shift Circuitry Vout GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS for Small Outline Package Device Figure 1. Fully Integrated Pressure Sensor Schematic (c) Freescale Semiconductor, Inc., 2005. All rights reserved. Table 1. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 200 -40 to +125 -40 to +125 Unit kPa C C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Minimum Pressure Offset(3) @ VS = 5.0 Volts Full Scale Output(4) @ VS = 5.0 Volts Full Scale Span(5) @ VS = 5.0 Volts Accuracy(6) Sensitivity Response Time(7) Output Source Current at Full Scale Output Warm-Up Time(8) Offset Stability(9) 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. (0 to 85C) Symbol POP VS Io Voff Min -25 4.75 -- 0.116 Typ -- 5.0 7.0 0.25 Max 25 5.25 10 0.384 Unit kPa Vdc mAdc Vdc (0 to 85C) VFSO 4.610 4.75 4.890 Vdc (0 to 85C) VFSS -- 4.5 -- Vdc (0 to 85C) -- V/P tR Io+ -- -- -- -- -- -- -- -- -- 90 1.0 0.1 20 0.5 5.0 ----------- %VFSS mV/kPa ms mAdc ms %VFSS The MPXV7025G series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, MPXV7025G 2 other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Sensors Freescale Semiconductor Figure 2 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. 5.0 4.5 Transfer Function: Vout = VS*(0.018*P+0.5) ERROR 4.0 VS = 5.0 Vdc 3.5 TEMP = 0 to 85C 3.0 Output (V) 2.5 2.0 1.5 1.0 0.5 0 -25 0 MAX Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. TYPICAL MIN 25 Differential Pressure (kPa) Figure 2. Output versus Pressure Differential +5 V Vout Vs IPS 1.0 F 0.01 F GND OUTPUT 470 pF Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) MPXV7025G Sensors Freescale Semiconductor 3 Transfer Function Nominal Transfer Value: Vout = VS (P x 0.018 + 0.5) (Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V 0.25 Vdc Temperature Error Band MPXV7025G SERIES 4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C. Temp -40 0 to 85 +125 Multiplier 3 1 3 Pressure Error Band Error Limits for Pressure 3.0 2.0 Pressure Error (kPa) 1.0 0.0 -1.0 -2.0 -3.0 Pressure -25 to 25 (kPa) Error (Max) 1.25 (kPa) -25 0 25 Pressure (in kPa) MPXV7025G 4 Sensors Freescale Semiconductor PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressure Part Number MPX7025GC6U/C6T1 MPXV7025GP MPXV7025DP sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Case Type 482A 1369 1351 Pressure (P1) Side Identifier Gauge, Axial Port, SMT Side with Port Attached Side with Part Marking MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 TYP 8X 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 4. Small Outline Package Footprint MPXV7025G Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS -A4 5 D 8 PL 0.25 (0.010) M TB S A S N -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -TSEATING PLANE DIM A B C D G H J K M N S V W CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV7025G 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.006 (0.15) C A B A E e 5 4 GAGE PLANE e/2 .014 (0.35) D L DETAIL G A1 8 1 F b 0.004 (0.1) 8X M CAB B E1 STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8. GND +Vout Vs -Vout N/C N/C N/C N/C STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8. N/C Vs GND Vout N/C N/C N/C N/C NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MILLIMETERS MIN MAX MIN MAX 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0 7 0 7 N T A M P 8X 0.004 (0.1) SEATING PLANE K DETAIL G C CASE 1351-01 ISSUE O SMALL OUTLINE PACKAGE MPXV7025G Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS 2 PLACES 4 TIPS 0.008 (0.20) C A B A E e 5 4 GAGE PLANE e/2 .014 (0.35) D L DETAIL G A1 8 1 8X F b 0.004 (0.1) M CAB B E1 NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MILLIMETERS MIN MAX MIN MAX 0.300 0.330 7.11 7.62 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.717 BSC 18.21 BSC 0.465 0.485 11.81 12.32 0.100 BSC 2.54 BSC 0.245 0.255 6.22 6.47 0.120 0.130 3.05 3.30 0.061 0.071 1.55 1.80 0.270 0.290 6.86 7.36 0.080 0.090 2.03 2.28 0.009 0.011 0.23 0.28 0.115 0.125 2.92 3.17 0 7 0 7 T N K A 0.004 (0.1) SEATING PLANE M P 8X DETAIL G C CASE 1369-01 ISSUE O SMALL OUTLINE PACKAGE MPXV7025G 8 Sensors Freescale Semiconductor NOTES MPXV7025G Sensors Freescale Semiconductor 9 NOTES MPXV7025G 10 Sensors Freescale Semiconductor NOTES MPXV7025G Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2005. All rights reserved. MPXV7025G Rev 0 05/2005 |
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